manufacturing technologies

Electromax manufacturing processes and manufacturing systems are designed to meet customers' unique and changing needs. Certified operators working with state-of-the-art equipment and qualified processes allow us to meet the highest standards of efficiency and flexibility.

Our manufacturing technologies include the following:

  • Assembly of PCB and Box build, including back planes, and flex circuits.
  • Value added services: Component Engineering, Mechanical Engineering, Documentation, DFM, DFT, ICT, Functional Test, Flying Probe test, and Conformal Coating.
  • Consigned and turn-key – mixed technology.
  • SMT assembly – Components – down to 0201; uBGA, CGA, CFN. Board size up to 20" X 24".
  • Wave solder – Board size up to 18" X 24".
  • Press fit connectors – ASG/Tyco programmable 5 ton capacity press.
  • Tin-lead, or RoHS (leadfree) solder.
  • IPC-A-610 Workmanship Class 2 or Class 3 as specified.
  • Inspection – AOI, X-Ray, and ERSA Scope.
  • Testing – ICT, Burn-in, Functional, and Final Test per customer requirements.
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